prospects of PCB via filling technology
The standard pcb via filling acts to transmit signals from one layer to another, but it can also be a source of issues if the structure is compromised. This is why PCB manufacturers have been using via filling and capping technologies to protect these connections from damage, including corrosion or material fractures. These advanced processes ensure that the vias can withstand vibration, humidity, mechanical shocks and extreme temperatures, which helps to ensure a long product lifespan.
These encapsulation methods can strengthen the connection between the copper layers and prevent contaminants from reaching the inside of the hole barrel. They can also improve the thermal management of a circuit board by dissipating heat away from hot spots and high-power components. In addition to this, the conductive epoxy used for via filling can improve the electrical performance of a via, helping to reduce signal loss.
Conductive via fills are especially useful for thermal vias, as they will quickly and effectively transfer the excess heat out of the device. As a result, they can greatly improve the reliability of a PCB. This is why you may still see some legacy PCB designs call for conductive via fills, even though the non-conductive option is generally preferred by most designers.
What are the future prospects of PCB via filling technology?
Regardless of the type of via fill, it is important that it be compatible with the board’s laminate materials. This is because the via fill will experience different amounts of expansion and contraction during a lifetime of use, which can cause stress fractures if the CTEs do not match up. This is why most design engineers settle on a non-conductive via fill, as it can offer the best compatibility between the via and the rest of the board.
For both conductive and non-conductive via fills, the plating process must be taken into consideration. This is because the copper used to plate a via shut will also be plated on all of the surface copper features of the PCB, which can be problematic for some designs. This is why it is important to carefully examine the PCB layout before deciding on the appropriate via fill, and to make sure that all of the copper features are properly aligned to avoid any problems.
For more information about the benefits of via filling and capping technology, contact a PCB manufacturer with extensive experience in the field. JHYPCB offers cutting-edge protection processes that utilize specialized via filling and capping formulations that are tailored to each PCB’s requirements. Our expert engineering team can help you choose the right solution to ensure that your boards will remain in pristine condition for a long time to come! Getting started is easy; simply get in touch to discuss your needs and receive a quote!